一、Semiconductor and Electronics Industry

1、Wafer processing

Used for thinning and surface treatment of silicon wafers and germanium wafers to ensure the flatness of subsequent photolithography processes (surface roughness ≤ Ra 0.1 μ m)

Typical equipment: CNC machine equipped with diamond grinding disc, with a machining thickness tolerance of ± 2 μ m

2、Electronic component manufacturing

Processing precision components such as quartz crystal resonators and ceramic substrates to enhance signal transmission stability

二、Optics and Glass Industry

1、Optical lens polishing

Eliminating surface defects of lenses and prisms, increasing transmittance by up to 3%

Specialized process: Combining cerium oxide polishing solution to achieve nanoscale smoothness (Ra<0.05 μ m)

2、Display panel processing

Used for final polishing of mobile phone cover glass and AR lenses, with a flatness error of ≤ 0.001mm

三、Machinery and Automotive Industry

1、Precision component processing

Flat grinding of bearing ring end face and hydraulic valve plate, with a parallelism of ± 1 μ m

Polishing the cutting edge of hard alloy cutting tools can extend their service life by more than 30%

2、Engine components

Single side treatment of piston rings and sealing rings to reduce friction losses

四、New Materials and Special Fields

1、Processing of hard and brittle materials

Thinning and mirror polishing of sapphire substrate and silicon carbide wafer

Copper or resin composite discs should be used in conjunction to avoid material edge breakage

2、Medical devices

Surgical blades, precision polishing of implant surfaces, improved biocompatibility

五、Research and Laboratory

Preparation of Materials Science Samples (such as Metal Thin Films, Superconducting Materials)

Paired with a synthetic copper plate, the entire process experiment from rough grinding to mirror polishing can be achieved