The following is a comprehensive analysis and maintenance recommendation regarding the replacement cycle of grinding and polishing pads:

一、Regular replacement cycle

1、Semiconductor manufacturing field

The standard lifespan of CMP polishing pads is 45-75 hours, which may be shortened to several tens of hours on high load production lines

Diamond grinding pads, due to their excellent wear resistance, can significantly extend the replacement cycle

2、Industrial General Scenarios

The service life of thicker polishing pads (such as>2mm) can be 2-3 times that of ordinary pads

It is recommended to check the polishing cloth for metallographic preparation after each use, and replace it immediately if there is obvious wear and tear

二、Key factors affecting lifespan

1、Material hardness

Processing hard materials such as silicon carbide increases wear rate by 30%+

2、Process requirements

Processes below 14nm require more frequent adjustments (every 10-15 hours)

3、mechanical parameters

Accelerated wear with pressure>3psi or speed>120rpm

三、Maintenance and optimization suggestions

1、Daily maintenance

Clean the residual abrasive after each use (to prevent the pad surface from hardening)

Deeply clean the microporous structure with a specialized cleaning agent every week

2、Performance monitoring

Immediate replacement is required in the following situations:

Scratches larger than 0.5mm appear on the surface

Polishing rate decreases by more than 20%

The surface roughness Ra value of the workpiece fluctuates by more than 15%