Application area

Mainly used for double-sided grinding and polishing of semiconductor chips, piezoelectric crystals, optical glass, mobile phone glass, sapphire, precision ceramics, mechanical seals, silicon, piston rings, valve plates, valve plates, molybdenum plates, hard alloy blades, hardware, etc. with high requirements for flatness, parallelism, and thickness accuracy.

Equipment principle

The equipment is designed for double-sided precision grinding/polishing. The grinding product is equipped with a special planetary wheel fixture placed on the lower plate. The workpiece is rotated by the central gear to rotate the planetary wheel, causing it to rotate or revolve. The upper grinding disc is pressed by a cylinder, and the upper and lower grinding discs rotate relative or in the same direction. The workpiece and grinding disc undergo relative motion and uniform friction to achieve the purpose of grinding and polishing the workpiece.

The parallelism/flatness can reach 1um, and the optimal roughness can reach 0.02um

Technical Parameter

Equipment features

1.Humanized control interface, system fault self diagnosis and alarm function, easy to find the cause and quickly resolve abnormalities.

2.Selecting Japan's "NSK" precision high-speed shaft system to ensure long-lasting and stable machining accuracy of the equipment;

3.Adopting Taiwan's Delta programmable logic controller (PLC) system, the pressure is controlled by an electrical proportional valve, and various working parameters are set and displayed through a human-machine interface. Internally, it can store 10 sets of 7-step process parameters, greatly reducing the technical requirements for operators and comprehensively improving the automation level of the equipment.

4.The machine adopts a 3-motor drive mode, where the main engine, upper plate, and sun gear motors are all independently driven, making the transmission force more dispersed. The sun gear is controlled by a separate motor, which can adjust the speed freely to achieve forward and reverse rotation of the cruise ship. During grinding, the effect of grinding while repairing the disc is achieved, reducing the number of disc repairs and improving efficiency. When repairing the disk, it is easier and more effective to repair the disk surface.

5.The floating positioning device on the upper plate, combined with SMC pneumatic components and segmented precision pressure control, operates stably, challenging the advantages of ultra-thin materials.

6.Our self-developed precision self proclaimed feedback system can set back pressure and pressure, with a minimum pressure of 10KG.

7.The machine adopts a cylinder inclined lifting gear ring, and there is a gasket under the sun gear to adjust the position, effectively utilizing the gear ring and sun gear, while making the loading and unloading of the workpiece more convenient and safe

8.The machine adopts a gantry style fixed upper plate, which makes the upper plate more stable and prevents it from falling off after it rises. It is equipped with an automatic safety lock device, which provides a certain level of safety performance during operation.

Processing case sharing

1.Semiconductor copper-clad laminate

2.Lithium battery blade

3.Aluminum nitride ceramics

4.optical glass

5.Three types of electronic ceramic substrates

6.Molybdenum sheet double-sided polishing